UEP2025 business progress

20 March 2023

ETHERNITY NETWORKS LTD.

("Ethernity" or the "Company")

UEP2025 business progress

Ethernity Networks (AIM: ENET.L; OTCQB: ENETF), a leading supplier of data processing semiconductor technology for networking appliances, is pleased to provide an update on commercial progress with its UEP2025 bonding product.  Following the official release of the Company's UEP2025 bonding product during the recent WISPA Event detailed below, the Company is experiencing further interest in the patented link bonding as follows:

Presentation at WISPA Event

Ethernity exhibited a live demo and presented a session on its link bonding technology at the WISPAmerica event in Louisville, Kentucky USA between 7-9 March 2023. The Directors believe that the technology and the UEP2025 system created excitement among the wireless internet service providers ("WISPs") by providing the ability to dynamically distribute data along multiple wireless links of the same or different speeds and technologies, overcoming lost connections and degraded effective capacities that are the result of environmental factors, as well as the ability to do so regardless of the radio vendor. 

As a next stage, the Company plans to supply the UEP2025 product to several WISPs in the USA for initial product introduction into the WISP network during Q2 2023, as a result of demand generated during the event. Following the product introduction, the Company anticipates that the WISPs will be able to expand the deployment of the product into the rest of their networks, which could lead to larger orders for the UEP2025 bonding product. Further expansion to the larger WISP community would then come through the Company's OEM partners.

Existing Bonding OEM customer

On 17 January 2023, the Company announced that it had delivered a UEP2025 for testing and integration with an existing prominent microwave wireless OEM customer. The Company is now delivering additional, fully integrated UEP2025s to the customer's sales and marketing teams to allow them to properly introduce the UEP2025 bonding product to their large WISP-based customers, in anticipation of orders for the product.

David Levi, CEO of Ethernity Networks, commented: "We have believed from the outset that our patented link bonding technology has the potential to be a game changer for the wireless industry, and with the release of the UEP2025 product with bonding support, software configuration and management software, we believe that we are delivering a must-have offering for high-capacity wireless delivery."

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About Ethernity ( www.ethernitynet.com )

Ethernity Networks (AIM: ENET.L OTCQB: ENETF) provides innovative, comprehensive networking and security solutions on programmable hardware that increase telco/cloud network infrastructure capacity. Ethernity's semiconductor logic offers data processing functionality for different networking applications, innovative patented wireless access technology, and fibre access media controllers, all equipped with control software with a rich set of networking features. Ethernity's solutions quickly adapt to customers' changing needs, improving time-to-market, and facilitating the deployment of 5G over wireless and fibre infrastructure.